• DocumentCode
    2777241
  • Title

    High-Density, Low-Mating-Force, Magnetically-Coupled, Percutaneous Connector for Implanted Electrode Arrays

  • Author

    Smith, Christopher F. ; Guillory, K. Shane

  • Author_Institution
    Ripple LLC, Salt Lake, UT
  • fYear
    2007
  • fDate
    2-5 May 2007
  • Firstpage
    446
  • Lastpage
    449
  • Abstract
    As the fields of neuroscience and neural engineering have advanced, chronic implantable microelectrode arrays with 16 to 256 active channels have reached widespread use. However, implanted connector systems for these arrays have not received much attention and are a common source of experiment failure and irregularities. Intermittent connections, unreliable mechanical coupling, contamination, breaks and failures of materials, and high mating forces are common issues that plague most of the connector schemes used today. This paper discusses the design of a novel percutaneous connector for implanted microelectrode arrays with up to 128 individual channels, that addresses many of these issues. The implanted pedestal uses an array of high-density contacts, distributed in a titanium base that can be mounted to bone or other fixation points. The external connector uses an array of spring-loaded pins to make electrical contact and an innovative magnetic coupling mechanism to mate and hold the connector to the pedestal. The implanted pedestal can be produced inexpensively, and the connector can be mated and unmated without applying significant forces to the pedestal
  • Keywords
    microelectrodes; neurophysiology; prosthetics; titanium; chronic implantable microelectrode arrays; implanted connector systems; innovative magnetic coupling; mechanical coupling; neural engineering; neuroscience; percutaneous connector; titanium base; Bones; Connectors; Contacts; Contamination; Electrodes; Microelectrodes; Neural engineering; Neuroscience; Pins; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering, 2007. CNE '07. 3rd International IEEE/EMBS Conference on
  • Conference_Location
    Kohala Coast, HI
  • Print_ISBN
    1-4244-0792-3
  • Electronic_ISBN
    1-4244-0792-3
  • Type

    conf

  • DOI
    10.1109/CNE.2007.369705
  • Filename
    4227310