• DocumentCode
    2777300
  • Title

    Analysis of electromagnetic field penetration through apertures based on electromagnetic topology

  • Author

    Park, Yoon-Mi ; Lee, Younju ; Chung, Young-Seek ; Cheon, Changyul ; Jung, Hyun-Kyo

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul
  • fYear
    2008
  • fDate
    5-11 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a method for computation of electromagnetic field penetration is proposed. A cavity model with an aperture was analyzed using electromagnetic topology (EMT) based on Baum-Liu-Tesche (BLT) equation. The rectangular cavity Greendasias function is used to determine the fields in the cavity and the free space Greendasias function is used to determine the scattered fields due to the aperture in the free space. The equations are substituted in the BLT equation and determine electromagnetic field penetration. The results from topological modeling are in agreement with simulation results. In this research, field coupling phenomenon between external fields and a wire in the cavity is studied, thus further research is required relating EMC analysis to the integrated circuit in the cavity using EMT.
  • Keywords
    Green´s function methods; computational electromagnetics; electromagnetic compatibility; electromagnetic interference; electromagnetic wave scattering; Baum-Liu-Tesche equation; EMC analysis; cavity model; electromagnetic compatibility; electromagnetic field penetration computation; electromagnetic interference; electromagnetic topology; field coupling phenomenon; finite difference time domain method; free space Green function; rectangular cavity Green function; scattered fields; topological modeling; Apertures; Circuit simulation; Coupling circuits; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Electromagnetic scattering; Equations; Topology; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2041-4
  • Electronic_ISBN
    978-1-4244-2042-1
  • Type

    conf

  • DOI
    10.1109/APS.2008.4619877
  • Filename
    4619877