Title :
Unique White LED Packaging Systems
Author :
Okuno, Atsushi ; Miyawaki, Yoshiteru ; Oyama, Noritaka ; Dongxu, Wang
Author_Institution :
Sanyu Rec Co., Ltd., Osaka
Abstract :
Many engineers are developing White LED in the world. LED Packaging is used normal transparent epoxy resin. But White LED is occurring a few UV light from Blue LED element itself. Normal transparent epoxy resin discolors by this UV light from Blue LED element. And it is difficult to preserve for long time White color after packaging. General packaging method is used casting molding method. This method can´t product high density, light weight packaging. At the first time, we developed special transparent epoxy resin to preserve White LED by improving epoxy chemical structure. We get very good result after humidity evaluation (60degC /85%/300 hrs/20 mA).Normal transparent epoxy resin discolors after this evaluation condition. On secondly, we developed high-density packaging technology using VPEStrade (Vacuum Printing Encapsulation Systems). These good advantages are very fine pitch and low height, high-density packaging technology, good mass production, and low cost systems. We successes very high density and high reliability White LED packaging using high level of transparent epoxy resin and VPEStrade technology. Our White LED can use as lighting application instead of fluorescent lamp and general lighting and traffic signal. And this light is very good
Keywords :
casting; light emitting diodes; moulding; packaging; resins; Blue LED; LED packaging systems; UV light; Vacuum Printing Encapsulation Systems; White LED; casting molding; epoxy chemical structure; high-density packaging technology; light weight packaging; transparent epoxy resin; Casting; Chemical elements; Chemical technology; Epoxy resins; Fluorescent lamps; Humidity; LED lamps; Light emitting diodes; Packaging; Systems engineering and theory; Heat resistance and UV resistance; VPES; White LED;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430626