• DocumentCode
    2777468
  • Title

    3D/SiP Key Process Technology Trend

  • Author

    Onishi, T.

  • Author_Institution
    Grand Joint Technology Ltd, onishite@netvigator.com
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    41
  • Abstract
    A collection of slides from author´s conference presentation is given.
  • Keywords
    grinding; lead bonding; sputter etching; stress effects; system-in-package; wafer bonding; wafer level packaging; die bonding; plasma etching; stacked die; stress relief; system in package; thin wafer technology; wafer tinning; wire bonding; Blades; Etching; Global Positioning System; Packaging; Plasma applications; Stress; Surface cracks; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430627
  • Filename
    4430627
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2777468