Title :
A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints
Author :
Kim, Llho ; Lee, Soon-Bok
Author_Institution :
KAIST, Daejeon
Abstract :
A collection of slides from the authors conference presentation is given.
Keywords :
fatigue; finite element analysis; printed circuits; solders; thermal stress cracking; PCB; comparative study; finite element model; lead free solder joints; mechanical fatigue behavior; thermal behavior; Coils; Cooling; Environmentally friendly manufacturing techniques; Fatigue; Heating; Lead; Magnetic field induced strain; Packaging; Soldering; Springs;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430630
