• DocumentCode
    2777565
  • Title

    A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints

  • Author

    Kim, Llho ; Lee, Soon-Bok

  • Author_Institution
    KAIST, Daejeon
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    21
  • Abstract
    A collection of slides from the authors conference presentation is given.
  • Keywords
    fatigue; finite element analysis; printed circuits; solders; thermal stress cracking; PCB; comparative study; finite element model; lead free solder joints; mechanical fatigue behavior; thermal behavior; Coils; Cooling; Environmentally friendly manufacturing techniques; Fatigue; Heating; Lead; Magnetic field induced strain; Packaging; Soldering; Springs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430630
  • Filename
    4430630
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2777565