DocumentCode

2777635

Title

The Effect Of Sputter Deposition Parameters On Selected Properties Of Titanium-tungsten (TiW) Thin Films

Author

Winter, C.M.

Author_Institution

Advanced Micro Devices

fYear

1992

fDate

28-30 Sep 1992

Firstpage

124

Lastpage

128

Keywords

Conductivity; Fuses; Semiconductor films; Sputtering; Substrates; Temperature; Thermal stresses; Thin film devices; Titanium; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN

0-7803-0755-0

Type

conf

DOI

10.1109/IEMT.1992.639875

Filename

639875