In-situ study on the effects of temperature and size on the electromigration characteristics of eutectic SnPb and Pb-free solder alloys

Author

Lee, Y.D. ; Kim, O.H. ; Younq-Bae Park ; Yoon, M.S. ; Kim, B.N. ; Young-Chang Joo

Author_Institution

Andong Nat. Univ., Andong

fYear

2006

fDate

11-14 Dec. 2006

Abstract

The article consists of a Powerpoint presentation on electromigration characteristics eutectic SnPb and Pb-free solder alloys. The paper concludes that fundamental electromigration characteristics of eutectic SnPb and SnAgCu lines is obtained using in-situ SEM observation. Alloying effect on existence of incubation time. Incubation stage exists in eutectic SnPb due to the preceding Pb migration, while there was no incubation stage in SnAgCu because it acts as nearly pure Sn phase. Temperature effect on dominant migration phases and hillock phases in eutectic SnPb. Line length effect on incubation time & threshold current density in eutectic SnPb.

Keywords

copper alloys; current density; electromigration; eutectic alloys; flip-chip devices; lead alloys; reliability; scanning electron microscopy; silver alloys; solders; thermal analysis; thermoelectricity; tin alloys; SnAgCu; SnPb; alloying effect; atomic size factor; bump size; chemical potential driving force; dominant migration phases; electrical reliability; electromigration characteristics; eutectic solder alloys; flip chip solder bump; hillock phases; in-situ SEM observation; in-situ temperature effects; incubation stage; incubation time; lead-free solder alloys; line length effect; threshold current density; Anodes; Cathodes; Electromigration; Flip chip; Research and development; Temperature; Testing; Threshold current; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0833-7

Type

conf

DOI

10.1109/EMAP.2006.4430639

Filename

4430639