DocumentCode
2777737
Title
Assessment of MicroInductors for DC-DC Converters
Author
Flynn, David ; Lu, Hua ; Bailey, Chris ; Desmulliez, Marc
Author_Institution
Heriot-Watt Univ., Edinburgh
fYear
2006
fDate
11-14 Dec. 2006
Firstpage
1
Lastpage
7
Abstract
There are increasing demands on the power density and efficiency of DC-DC power converters due to the soaring functionality and operational longevity required for today´s electronic products. In addition, DC-DC converters are required to operate at new elevated frequencies in the MHz frequency regime. Typical ferrite cores, whose useable flux density falls drastically at these frequencies, have to be replaced and a method of producing compact component windings developed. In this study, two types of microinductors, pot-core and solenoid, for DC-DC converter applications have been analyzed for their performance in the MHz frequency range. The inductors were manufactured using an adapted UV-LIGA process and included electrodeposited nickel-iron and the commercial alloy Vitrovac 6025 as core materials. Using a vibrating sample magnetometer (VSM) and a Hewlett Packard 4192A LF- impedance analyzer, the inductor characteristics such as power density, efficiency, inductance and Q-factor were recorded. Experimental, finite element and analytical results were used to assess the suitability of the magnetic materials and component geometries for low MHz operation.
Keywords
DC-DC power convertors; LIGA; finite element analysis; inductors; magnetic cores; solenoids; DC-DC converters; Hewlett Packard 4192A LF- impedance analyzer; NiFe; Q-factor; UV-LIGA process; Vitrovac 6025 alloy; compact component windings; component geometries; efficiency characteristic; ferrite cores; finite element analysis; inductance characteristic; inductor characteristics; magnetic materials; microinductors; pot-core microinductor; power density; solenoid microinductor; vibrating sample magnetometer; DC-DC power converters; Ferrites; Frequency conversion; Inductors; Magnetic analysis; Magnetic materials; Manufacturing processes; Nickel alloys; Performance analysis; Solenoids;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location
Kowloon
Print_ISBN
978-1-4244-0834-4
Electronic_ISBN
978-1-4244-0834-4
Type
conf
DOI
10.1109/EMAP.2006.4430641
Filename
4430641
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