DocumentCode :
2777772
Title :
Micromanipulators composed of Hinges and Links
Author :
Horie, Mikio ; Kamiya, Daiki
Author_Institution :
Tokyo Inst. of Technol., Yokohama
fYear :
2006
fDate :
11-14 Dec. 2006
Firstpage :
1
Lastpage :
8
Abstract :
In the present paper, three kinds of manipulators are shown and their characteristics are discussed. Their manipulators are as follows, (1) a micromanipulator with flexural hinges for handling micro size objects, (2) a micromanipulator with large-deflective elastic hinges for microbonding by adhesives, and (3) a molding pantograph mechanism with large-deflective hinges, which is used as one component mechanism of a palmtop surface mount system using at the one room factory. In the case of the micromanipulator with flexural hinges, its micromanipulator had a good handling performance about glass balls whose diameter is 50 or 100 mum. In the case of the micro manipulator with large-deflective elastic hinges for microbonding by adhesives, a new bonding system of a slight amount of adhesives was found, and its good performance were confirmed in experiments. In the case of the molding pantograph mechanism with large-deflective hinges whose materials are polypropylene, it was confirmed that the hinge in the mechanism had not fractured even if more than one million repeatable motion of the mechanism in the mechanism´s fatigue test. Moreover, in order to have a long life hinge, the fatigue process toward the fracture of the hinge specimen was clarified in experiments by hinge-specimen´s fatigue test.
Keywords :
adhesives; bonding processes; fatigue testing; micromanipulators; pantographs; surface mount technology; adhesives; fatigue test; flexural hinges; large-deflective elastic hinges; micro size objects; microbonding; micromanipulators; molding pantograph mechanism; palmtop surface mount system; polypropylene; Fasteners; Fatigue; Fingers; Friction; Glass; Laboratories; Micromanipulators; Needles; Paper technology; Personal digital assistants;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
Type :
conf
DOI :
10.1109/EMAP.2006.4430643
Filename :
4430643
Link To Document :
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