Title :
Tin Whisker Accelerated Test Project
Author :
Lee, Chieh-Ju ; Reynolds, Heidi
Author_Institution :
Cisco Syst. Inc., San Jose
Abstract :
A collection of slides from the authors conference presentation is given.
Keywords :
electroplating; life testing; tin; whiskers (crystal); accelerated test project; tin plating; tin whisker; Guidelines; Humidity; Life estimation; Production; Standards publication; Telephony; Testing; Thermal stresses; Tin; Zinc;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430656
