Title :
Mapping Package Power Distribution Network Behavior into Electrical Parameters
Author :
Shi, Hong ; Yew, Yeehuan ; Jiang, Xiaohong
Author_Institution :
Altera Corp., San Jose
Abstract :
This paper describes a systematic approach to map "black box" s-parameter behavior model into electrically meaningful RLC parameters based on physical layout and impedance transfer function theory. The s-parameter models are from either field solvers or from lab bench VNA measurement".
Keywords :
electric impedance; electronics packaging; power electronics; transfer functions; RLC parameter; black box s-parameter behavior model; electrical parameter; impedance transfer function theory; package power distribution network behavior; Capacitors; Circuit topology; Equivalent circuits; Frequency; Impedance; Packaging; Poles and zeros; Power system modeling; Power systems; Scattering parameters;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430657
