Title :
Low Temperature Processable Ultra-Low Dielectric Porous Polyimide for High Frequency Applications
Author :
Ren, Yuxing ; Lam, D.
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Kowloon
Abstract :
Ultra-low dielectric porous polymer coatings reduce electrical losses of high speed and high frequency circuitries. In this investigation, a room temperature process to produce ultra-low dielectric polyimide films was developed. The films have low elastic properties which reduce thermal stresses and package warpage. The dielectric properties of the porous polyimide were characterized at 100 KHz as well as between 8.2 and 18 GHz. Results showed that the dielectric constant reached as low as 1.67 in high porosity films. The results indicate that the high frequency dielectric properties are stable and the films are suited for use in wide band applications. On the basis of the improved properties, the usages of low temperature processable ultra-low-k polyimide in advanced applications are discussed.
Keywords :
dielectric thin films; elasticity; electronics packaging; evaporation; low-temperature techniques; microwave circuits; permittivity; phase separation; polymer films; porous materials; thermal stresses; dielectric constant; elastic properties; electrical losses reduction; frequency 100 kHz; frequency 8.2 GHz to 18 GHz; high frequency applications; high frequency circuitries; high frequency dielectric properties; high speed circuitries; low temperature process; package warpage reduction; temperature 293 K to 298 K; thermal stresses reduction; ultra-low dielectric porous polyimide coatings; Circuits; Dielectric constant; Dielectric films; Dielectric losses; Frequency; Packaging; Polyimides; Polymer films; Temperature; Thermal stresses;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430666
