Migration behavior in minute wiring on flexible substrate and establishment of evaluation method

Author

Kimura, Yuji ; Isawa, Sanae ; Chino, Mitsuru ; Hara, Hidekazu ; Tamayama, Koji ; Suzuki, Azusa

Author_Institution

Kogakuin Univ., Tokyo

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

4

Abstract

In order to actualize the fine pitch of wiring in FPC (Flexible Printed Circuit), the insulation degradation due to the migration becomes the problem, which cannot be ignored. Because of difference in its structure and wiring from the former printed circuit board, the analysis of migration behavior in FPC becomes important for evaluating the reliability of an electronic component based on FPC. In this research, in order to grasp the migration behavior of FPC, the paragraphed 30 mum pitch tooth profile wiring specimen was designated as the test material. Then, reliability test for evaluating the migration behavior was conducted. As a result of THB (hot high moisture bias) test, the migration occurred progressively. Various investigations were conducted for explaining about the mechanism of ionic migration. Also in this paper, the adhesive strength between the polyimide film and Cu wiring pattern and that between the polyimide film and the under-filling material was measured in order to investigate the influence of surface state of polyimide film upon the migration behavior.

Keywords

adhesion; copper; electromigration; fine-pitch technology; flexible electronics; integrated circuit reliability; integrated circuit testing; micromechanical devices; polymer films; printed circuit testing; wiring; Cu; adhesive strength; copper wiring pattern; electronic component reliability test; fine pitch technology; flexible printed circuit; flexible substrate; hot high moisture bias test; insulation degradation; ionic migration mechanism; migration behavior analysis; minute wiring; polyimide film; size 30 mum; under-filling material; Circuit analysis; Conducting materials; Degradation; Electronic components; Flexible printed circuits; Insulation; Polyimides; Substrates; Testing; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430672

Filename

4430672