DocumentCode :
2778351
Title :
A new thermo-electrical life model based on space-charge trapping
Author :
Dissado, L. ; Mazzanti, G. ; Montanari, G.C.
Author_Institution :
Dept. of Eng., Leicester Univ., UK
Volume :
2
fYear :
1996
fDate :
16-19 Jun 1996
Firstpage :
642
Abstract :
A new thermo-electrical model which relates the time-to-formation of microcavities or crazes in insulating materials to the applied DC electrical and thermal stresses is proposed. The model is based on the Eyring law, but factors are introduced in the expression of the state free energy, which are functions of the electrostatic and electromechanical energy associated with space-charge trapped within the material. The presence of both electrical and thermal thresholds characterizes the model which can, therefore, describe properly typical behaviours of polymeric insulating materials reported in literature. In the paper, the model is applied to the results of multistress life tests performed, at different levels of temperature and electric stress, on flat specimens of polyethylene-terephthalate (PET). It is shown that the model can satisfactorily describe the behaviour of the experimental data, providing insights into the chemical-physical characteristics of the insulation
Keywords :
electric breakdown; insulation testing; life testing; polyethylene insulation; space charge; thermal stresses; trees (electrical); voids (solid); DC electrical stress; Eyring law; crazes; electrical thresholds; electromechanical energy; electrostatic energy; microcavities; polyethylene-terephthalate; polymeric insulating materials; space-charge trapping; state free energy; thermal stress; thermal thresholds; thermo-electrical life model; time-to-formation; Dielectrics and electrical insulation; Electrostatics; Life testing; Microcavities; Performance evaluation; Plastic insulation; Polymers; Positron emission tomography; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1996., Conference Record of the 1996 IEEE International Symposium on
Conference_Location :
Montreal, Que.
ISSN :
1089-084X
Print_ISBN :
0-7803-3531-7
Type :
conf
DOI :
10.1109/ELINSL.1996.549427
Filename :
549427
Link To Document :
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