DocumentCode
2778531
Title
Comparison of Two Advanced Substrate Technologies in a High End Networking Application
Author
Priest, Judy ; Li, Li ; Xue, Jie
Author_Institution
Cisco Syst. Inc., San Jose
fYear
2006
fDate
11-14 Dec. 2006
Firstpage
1
Lastpage
21
Abstract
A collection of slides from the authors conference presentation is given.
Keywords
flip-chip devices; integrated circuit reliability; substrates; system-in-package; advanced substrate technologies; flip chip; high end networking application; reliability; system in package; Assembly; Flip chip; Laminates; Moisture; Semiconductor device measurement; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location
Kowloon
Print_ISBN
978-1-4244-0834-4
Electronic_ISBN
978-1-4244-0834-4
Type
conf
DOI
10.1109/EMAP.2006.4430689
Filename
4430689
Link To Document