Title :
Comparison of Two Advanced Substrate Technologies in a High End Networking Application
Author :
Priest, Judy ; Li, Li ; Xue, Jie
Author_Institution :
Cisco Syst. Inc., San Jose
Abstract :
A collection of slides from the authors conference presentation is given.
Keywords :
flip-chip devices; integrated circuit reliability; substrates; system-in-package; advanced substrate technologies; flip chip; high end networking application; reliability; system in package; Assembly; Flip chip; Laminates; Moisture; Semiconductor device measurement; Temperature;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430689
