Title :
Current Density Dependence of EM (Electromigration)-Induced Flip-Chip Cu Pad Consumption
Author :
Liao, P.L. ; Liu, C.Y.
Author_Institution :
Nat. Central Univ., Jhongli
Abstract :
The article consists of a Powerpoint presentation on current density dependence of electromigration induced flip-chip Cu pad consumption. The areas discussed include: electromigration; failure models; annealing; current density; activation energy; copper consumption and current stressing.
Keywords :
annealing; copper; current density; electromigration; failure analysis; flip-chip devices; Cu; activation energy; annealing; current density; current stressing; electromigration; failure models; flip-chip copper pad consumption; Annealing; Bonding; Cathodes; Copper; Current density; Electromigration; Electrons; Ice surface; Temperature; Tin;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0833-7
DOI :
10.1109/EMAP.2006.4430690
