Title :
Study of Interfacial Reactions by Ni/Sn5Ag/Cu Sandwich Structure
Author :
Tseng, H. WV ; Liu, C.Y.
Author_Institution :
Nat. Central Univ., Jhongli
Abstract :
A collection of slides from the author´s conference presentation is given.
Keywords :
copper; heat treatment; interface phenomena; nickel; sandwich structures; tin compounds; Ni-SnAg-Cu; interfacial reactions; sandwich structure; Chemical analysis; Chemical compounds; Chemical engineering; Chromium; Drag; Moon; Sandwich structures;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0833-7
DOI :
10.1109/EMAP.2006.4430691
