Characterization of Wire Bondability on Overhang Structured Chip in Multi Chip Package

Author

Shin, Dongkil ; Kwak, Dongok ; Song, Younghee ; Chung, Myungkee ; Ahn, Eunchul ; Cho, Kyoungbok

Author_Institution

Samsung Electron. Co., Hwaseong

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

6

Abstract

Characteristics of wire bonding on the overhang structured chip were investigated in this study. During the wire bonding process, chip crack and bondability were severe factors for thin wafer bonding. Chip crack was investigated by chip strength test and parametric study was performed by changing bonding parameters, constant velocity, force, and power. Bondability was measured for 500, 700, and 1000 mum overhang length. Bonding strength was tested by ball shear test method. 700 mum overhang showed better performance than 500 mum. 1000 mum overhang showed very low bondability. Bonding characteristics were observed by numerical FEM method. Nonlinear dynamic analysis was performed. Unstable contact pressure and shear stress were observed between ball and metal pad. Noise of reaction force was increased with overhang length.

Keywords

crack detection; finite element analysis; integrated circuit bonding; integrated circuit packaging; lead bonding; multichip modules; bonding strength; chip strength test; contact pressure; multi chip package; nonlinear dynamic analysis; numerical FEM method; overhang structured chip; reaction force noise; shear stress; size 1000 mum; size 500 mum; size 700 mum; thin wafer bonding; wire bondability; Bonding forces; Bonding processes; Length measurement; Packaging; Parametric study; Performance evaluation; Semiconductor device measurement; Testing; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430692

Filename

4430692