• DocumentCode
    2778787
  • Title

    Alternative approaches for low temperature front surface passivation of interdigitated back contact silicon heterojunction solar cell

  • Author

    Shu, Brent ; Das, Ujjwal ; Appel, Jesse ; McCandless, Brian ; Hegedus, Steven ; Birkmire, Robert

  • Author_Institution
    Inst. of Energy Conversion, Univ. of Delaware, Newark, DE, USA
  • fYear
    2010
  • fDate
    20-25 June 2010
  • Abstract
    In this work, we investigated two alternative approaches for the front surface passivation of interdigitated back contact silicon heterojunction (IBC-SHJ) solar cells: (1) with plasma enhanced chemical vapor deposited (PEVCD) a-Si-based stack structure consisting of a-Si:H/a-SiNx:H/a-SiC:H, and (2) with physical vapor deposited (PVD) zinc sulfide (ZnS) film. The processing temperatures for both the approaches are under 300°C. Effective surface recombination velocities (SRV) of <; 6.2cm/s and <; 35cm/s are obtained with stack structure and ZnS respectively on n-type float zone (FZ) crystalline silicon (c-Si) wafers. The anti-reflection (AR) properties of these two passivation approaches are studied and the optimization procedure of the stack structure was discussed and shown to improve the photo-generated current. The IBC-SHJ solar cells were fabricated using both the front surface passivation approaches and a 15% cell efficiency was achieved on 150μm thick FZ c-Si wafer without surface texturing and optical optimization.
  • Keywords
    antireflection coatings; passivation; plasma CVD; solar cells; surface recombination; antireflection properties; efficiency 15 percent; interdigitated back contact silicon heterojunction solar cell; low temperature front surface passivation; plasma enhanced chemical vapor deposited; size 150 mum; surface recombination velocities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
  • Conference_Location
    Honolulu, HI
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-5890-5
  • Type

    conf

  • DOI
    10.1109/PVSC.2010.5616755
  • Filename
    5616755