DocumentCode
2779457
Title
Printed Circuit Board Assembly/soldering Initiatives At Penn State
Author
Lehtihet, E.A.
Author_Institution
Penn State University, University Park Pa, 16802
fYear
1992
fDate
28-30 Sep 1992
Firstpage
169
Lastpage
173
Keywords
Assembly; Design engineering; Electronics industry; Laboratories; Manufacturing industries; Manufacturing processes; Printed circuits; Reliability engineering; Soldering; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639884
Filename
639884
Link To Document