Title :
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)
Abstract :
The following topics were dealt with: system design; power distribution; measurements and emissions; modelling; RF/microwave packaging; and on-chip issues
Keywords :
design engineering; integrated circuit design; modelling; packaging; power supply circuits; RF packaging; emissions; microwave packaging; modelling; on-chip issues; power distribution; system design;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ, USA
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895479
