Title :
Leveraging high density packaging for high performance DSP systems
Author :
Mehrotra, Pronita ; Rao, Vikram ; Conte, Tom ; Franzon, Paul
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
The high connectivity of SHOCC (seamless high off-chip connectivity) technology can be exploited to increase the number of memory channels in a DSP system. This paper describes the physical and logical architecture of a high performance FFT system enabled by a combination of high density packaging and good memory management schemes, with an emphasis on signal integrity issues
Keywords :
digital signal processing chips; fast Fourier transforms; integrated circuit interconnections; integrated circuit packaging; logic design; storage management; DSP system; FFT system; SHOCC technology; connectivity; high density packaging; high performance DSP systems; logical architecture; memory channels; memory management schemes; physical architecture; seamless high off-chip connectivity technology; signal integrity; Computer architecture; Crosstalk; Dielectric substrates; Digital signal processing; Engines; Packaging; Routing; Signal analysis; Synthetic aperture radar; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895485
