Title :
Interconnect design for controlled-impedance systems
Author :
Diepenbrock, Joseph C. ; Evans, Robert J. ; Panella, Augusto P.
Author_Institution :
IBM Corp., Research Triangle Park, NC, USA
Abstract :
This paper presents an application of an edgecard interconnect in a controlled impedance environment. Design of the baseboard, connector and daughter card are discussed, along with design trade-offs and features of the chosen solution
Keywords :
electric connectors; electric impedance; integrated circuit interconnections; integrated circuit packaging; printed circuit accessories; printed circuit design; system buses; baseboard design; connector design; controlled impedance environment; controlled-impedance systems; daughter card design; design trade-offs; edgecard interconnect; interconnect design; Conducting materials; Conductivity; Connectors; Control systems; Crosstalk; Inductance; Inorganic materials; Magnetic materials; Signal design; Surface impedance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895488
