DocumentCode
2779758
Title
Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards
Author
Sarkar, T.K. ; Kolundjiza, B. ; Djordjevic, A.R. ; Salazar-Palma, M.
Author_Institution
Dept. of Electr. & Comput. Sci., Syracuse Univ., NY, USA
fYear
2000
fDate
23-25 Oct. 2000
Firstpage
59
Lastpage
62
Abstract
This paper presents an accurate dynamic methodology for computing the frequency responses of multilayered ground planes filled with inhomogeneous dielectric materials. Since an integral equation based method based on the free space Green´s function has been utilized for computing the current distribution on the structures, the edge effects from the ground planes can be accurately accounted for, resulting in a more accurate model in the gigahertz regions. It provides great flexibility in computation of the impedance at any location between the various planes. The results have been compared with the S-parameters measured by other researchers and show good correlation with the available measurements.
Keywords
Green´s function methods; S-parameters; current distribution; dielectric thin films; electric impedance; frequency response; microwave circuits; packaging; printed circuits; S-parameters; boards; computation flexibility; current distribution; dynamic methodology; edge effects; free space Green´s function; frequency response; frequency responses; ground planes; inhomogeneous dielectric materials; integral equation based method; model accuracy; modeling; multilayered ground planes; multiple planes; packages; Dielectrics; Equations; Frequency; Green´s function methods; Impedance; Magnetic domains; Magnetic separation; Matrix converters; Packaging; Telecommunication computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ, USA
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895493
Filename
895493
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