Title :
On 2-D transmission line modeling of power and ground planes in multilayer structures
Author :
Tarvainen, Timo ; Kolehmainen, Jari
Author_Institution :
Esju Oy, Oulu, Finland
Abstract :
Multilayer RF structures including power and ground planes can form complicated resonators. This paper discusses 2D transmission line modeling of these structures. Modeled results are verified with measurements
Keywords :
circuit simulation; microwave circuits; packaging; printed circuit testing; resonators; transmission line theory; 2D transmission line modeling; ground plane; modeling; multilayer RF structures; multilayer structures; power planes; resonators; verification measurements; Conductors; Connectors; Copper; Crosstalk; Frequency; Nonhomogeneous media; Power transmission lines; Scattering parameters; Testing; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895501
