Title :
Multi-layer fully organic-based system on package (SOP) technology for RF applications
Author :
Davis, M.F. ; Sutono, A. ; Lim, K. ; Laskar, J. ; Tummala, R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the development and characterization of multi-layer fully organic-based system-on-package (SOP) technology, referred to as the single level integrated module (SLIM), for RF applications. A multi-layer transceiver architecture and a hybrid microstrip and coplanar waveguide interconnect scheme have been proposed and developed to allow high density interconnects. Coplanar waveguide transmission line test structures have been fabricated on the multi-layer material system and demonstrate an insertion loss of 1.4 dB/in at 13 GHz and a return loss better than 15 dB at 13 GHz
Keywords :
MMIC; coplanar transmission lines; coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; losses; modules; transceivers; 13 GHz; 15 dB; RF applications; SLIM; coplanar waveguide transmission line test structures; high density interconnects; hybrid microstrip/coplanar waveguide interconnect scheme; insertion loss; multi-layer fully organic-based SOP technology; multi-layer fully organic-based system-on-package technology; multi-layer material system; multi-layer transceiver architecture; return loss; single level integrated module; Coplanar transmission lines; Coplanar waveguides; Insertion loss; Materials testing; Microstrip; Packaging; Propagation losses; Radio frequency; System testing; Transceivers;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895503
