Optimizing VNA measurements by cascaded transmission lines for interconnect characterization

Author

Huang, Ching-Chao ; Feng, June

Author_Institution

Rambus Inc., Mountain View, CA, USA

fYear

2000

fDate

2000

Firstpage

107

Lastpage

110

Abstract

This paper models arbitrary interconnect structures by frequency-dependent coupled transmission lines in cascade. By optimizing the input impedance of shorted structures, we show that the RLGC parameters can be extracted reliably from the vector network analyzer (VNA) measurements. The probes and lead-in traces are easily de-embedded. It is interesting to see that a complex 3D structure can sometimes be modeled by a simple transmission line

Keywords

ball grid arrays; cascade networks; coupled transmission lines; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; network analysers; optimisation; transmission line theory; BGA package; RLGC parameter extraction; VNA measurement optimization; cascaded transmission lines; complex 3D structure model; de-embedded lead-in traces; de-embedded probes; frequency-dependent coupled transmission lines; input impedance optimization; interconnect characterization; interconnect structure models; lead-in traces; probes; vector network analyzer; vector network analyzer measurements; Circuit testing; Couplings; Frequency; Impedance measurement; Integrated circuit interconnections; Mathematical model; Probes; Transmission line matrix methods; Transmission line measurements; Transmission line theory;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895504

Filename

895504