DocumentCode
2779989
Title
Over 20 GHz microwave frequency model of fine pitch ball grid array (FPBGA) bonding
Author
Lee, Junho ; Ahn, Seungyoung ; Ryu, Jaeyoung ; Kim, Joungho
Author_Institution
Dept. of EE & CS, Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear
2000
fDate
2000
Firstpage
111
Lastpage
114
Abstract
A >20 GHz electrical model of fine pitch BGA bonding is reported. The model is experimentally extracted using microwave two-port S-parameter measurements. The fine-pitch ball has parameters of less than 0.08 nH, 0.20 pF and 1 mΩ
Keywords
MMIC; S-parameters; ball grid arrays; capacitance; electric resistance; fine-pitch technology; inductance; integrated circuit bonding; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microassembling; microwave measurement; soldering; 0.2 pF; 1 mohm; 20 GHz; FPBGA bonding; electrical model; experimentally extracted model; fine pitch BGA bonding; fine pitch ball grid array bonding; fine-pitch ball parameters; microwave frequency model; microwave two-port S-parameter measurements; Bonding; Coplanar waveguides; Electronics packaging; Equivalent circuits; Inductance; Joining processes; Microwave frequencies; Parasitic capacitance; Scattering parameters; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895505
Filename
895505
Link To Document