DocumentCode
2780051
Title
Low impedance power planes with self damping
Author
Novak, Istvan ; Smith, Larry ; Roy, Tanmoy
Author_Institution
SUN Microsyst. Inc., Burlington, MA, USA
fYear
2000
fDate
2000
Firstpage
123
Lastpage
126
Abstract
With the rapid increase of chip clock frequencies and power, the power distribution on printed-circuit boards must rely increasingly on power-ground plane pairs. The effects of dielectric thickness, dielectric constant, and parallel connection of power-ground plane pairs is discussed. It is shown that dielectric materials thinner than 0.5 mils naturally tend to suppress plane resonances
Keywords
dielectric thin films; electric impedance; integrated circuit interconnections; integrated circuit packaging; permittivity; power supply circuits; printed circuits; resonance; PCB power distribution; chip clock frequency; chip power; dielectric constant; dielectric materials; dielectric thickness; low impedance power planes; parallel power-ground plane pair connection; plane resonance suppression; power-ground plane pairs; self damping; Capacitance; Circuits; Damping; Dielectric constant; Dielectric losses; Dielectric materials; Frequency; Impedance; Inductance; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895508
Filename
895508
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