• DocumentCode
    2780075
  • Title

    Analog design challenges and trade-offs using emerging materials and devices

  • Author

    Fulde, M. ; Mercha, A. ; Gustin, C. ; Parvais, B. ; Subramanian, V. ; Arnim, K.V. ; Bauer, F. ; Schruefer, K. ; Schmitt-Landsiedel, D. ; Knoblinger, G.

  • Author_Institution
    Tech. Univ., Munich
  • fYear
    2007
  • fDate
    11-13 Sept. 2007
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or multiple-gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and Vt stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO2 dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient VT instabilities in the range of 10 mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.
  • Keywords
    analogue integrated circuits; analogue-digital conversion; field effect transistors; hafnium compounds; integrated circuit design; low-power electronics; silicon compounds; HfO2; SiON; analog circuits; analog design; analog device figures-of-merit; circuit design; multiple-gate FET; nonbinary analog-to-digital converters; power consumption; 1f noise; Analog circuits; Area measurement; Degradation; Energy consumption; FETs; Gain measurement; High K dielectric materials; High-K gate dielectrics; Power measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 2007. ESSDERC 2007. 37th European
  • Conference_Location
    Munich
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-1123-8
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2007.4430894
  • Filename
    4430894