Title :
Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms
Author :
Smorodin, Tobias ; Stecher, Matthias ; Glavanovics, Michael ; Wilde, Jürgen
Author_Institution :
Infineon Technol. AG, Munich
Abstract :
In this article the failure behavior of DMOS-switches under power-cycle stress is shown to be dominated by thermo-mechanical deformation of the metallization. The failure evolves without a significant influence from electromigration stress.
Keywords :
semiconductor device metallisation; semiconductor switches; DMOS-switch; double-diffused-MOS; power-cycle stress; thermo-mechanical failure mechanism; Aluminum; Copper; Electromigration; Failure analysis; Metallization; Switches; Temperature; Thermal stresses; Thermomechanical processes; Voltage;
Conference_Titel :
Solid State Device Research Conference, 2007. ESSDERC 2007. 37th European
Conference_Location :
Munich
Print_ISBN :
978-1-4244-1123-8
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2007.4430898
