DocumentCode :
2780160
Title :
Library development process for embedded capacitors in LTCC
Author :
Blood, William ; Ling, Feng ; Myers, Thomas ; Petras, Michael
Author_Institution :
Motorola Inc., Tempe, AZ, USA
fYear :
2000
fDate :
2000
Firstpage :
147
Lastpage :
150
Abstract :
RF modules are building blocks for future wireless communication products. A process that combines electromagnetic (EM) simulation with measurement data provides a means to develop circuit simulation libraries for embedded passive components in low temperature cofired ceramic (LTCC) substrates
Keywords :
ceramic capacitors; ceramic packaging; circuit simulation; electromagnetic field theory; modules; EM simulation; LTCC; RF modules; circuit simulation libraries; electromagnetic simulation; embedded capacitors; embedded passive components; low temperature cofired ceramic substrates; measurement data; simulation library development process; wireless communication products; Capacitors; Circuit simulation; Costs; Integrated circuit interconnections; Libraries; Parasitic capacitance; Printed circuits; Product design; Radio frequency; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
Type :
conf
DOI :
10.1109/EPEP.2000.895514
Filename :
895514
Link To Document :
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