Title :
Application of neural networks and genetic algorithms to RF and wireless packaging
Author :
Mittra, R. ; Suntives, A. ; Hossain, M.S. ; Ma, Ji-Fu ; Veremey, V.
Author_Institution :
Electromagn. Commun. Lab., Pennsylvania State Univ., University Park, PA, USA
Abstract :
Conventional approaches to design of RF and wireless packages, which require both simulation and optimization of a large number of passive and active circuits, is a very time consuming process; hence, the CPU time required to carry out virtual prototyping of these circuits can be unacceptably long. This paper presents a neural-network-based approach for design of these packages in a numerically efficient manner
Keywords :
active networks; circuit CAD; circuit optimisation; circuit simulation; genetic algorithms; microwave circuits; neural nets; packaging; passive networks; rapid prototyping (industrial); CPU time; RF packaging; active circuits; genetic algorithms; neural networks; neural-network-based approach; numerical efficiency; optimization; package design; passive circuits; simulation; virtual prototyping; wireless packaging; Artificial neural networks; Circuit simulation; Design optimization; Genetic algorithms; Microstrip; Neural networks; Packaging; Passive circuits; Radio frequency; Scattering parameters;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895516
