DocumentCode :
2780221
Title :
Modeling of impedance of rectangular cross-section conductors
Author :
Chen, Huabo ; Fang, Jiayuan
Author_Institution :
Dept. of Electr. Eng., California Univ., Santa Cruz, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
159
Lastpage :
162
Abstract :
The frequency dependence of the per-unit-length parameters R, L, C, G of transmission lines often must be taken into account in transient simulations of interconnects in IC chips and packages. In the transient simulation of transmission lines, in order to achieve high simulation efficiency, empirical closed form models are often used to represent frequency-dependent resistance and inductance properties of metal conductors. This paper presents a new closed form model for the frequency-dependent resistance and internal inductance of rectangular cross-section conductors. The model is established from numerical computation results by the partial element equivalent circuit (PEEC) method and is found to be more accurate than existing closed form models
Keywords :
circuit simulation; electric resistance; equivalent circuits; inductance; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; transient analysis; IC chips; IC packages; PEEC method; closed form model; closed form models; empirical closed form models; frequency dependence; frequency-dependent inductance properties; frequency-dependent internal inductance; frequency-dependent resistance; frequency-dependent resistance properties; impedance modeling; interconnects; metal conductors; numerical computation; partial element equivalent circuit method; per-unit-length parameters; rectangular cross-section conductors; simulation efficiency; transient simulations; transmission lines; Computational modeling; Conductors; Equivalent circuits; Frequency dependence; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit packaging; Power system transients; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
Type :
conf
DOI :
10.1109/EPEP.2000.895518
Filename :
895518
Link To Document :
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