Title :
High frequency modelling of power/ground plane pairs with lossy substrates
Author :
Yeo, Yong-Kee ; Iyer, Mahadevan K. ; Lee, Shih-Yen ; Leong, Mook-Seng
Author_Institution :
Dept. Adv. Packaging Dev. Support, Inst. of Microelectron., Singapore
Abstract :
A methodology for modelling power/ground plane pairs with lossy substrates has been developed. It is based on transmission lines and includes high frequency effects like dielectric loss and dispersion. A simulation model is constructed using this methodology and the results are compared with measurements and with another model using distributed lumped elements
Keywords :
dielectric losses; high-frequency effects; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; power supply circuits; transmission line theory; dielectric loss; dispersion; distributed lumped element model; high frequency effects; high frequency modelling; lossy substrates; measurements; power/ground plane pairs; simulation model; transmission lines; Dielectric losses; Dielectric materials; Dispersion; Frequency; Impedance; Organic materials; Planar transmission lines; Power transmission lines; Propagation losses; Skin effect;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895520
