Title :
Electrical package characterization using differential TDR techniques
Author :
Corey, Steve ; Smolyansky, Dima
Abstract :
Summary form only given. TDR has been extensively used for characterization of electronic packaging, and a number of papers have been published on the subject. Single-ended TDR modeling techniques have been described in detail in Tektronix Application Note 85W-8885-0 (1993) and standardized in JEDEC Publication no. 123 (JC-15 Committee, 1995). In this paper, we discuss the differential TDR package modeling techniques in more detail, and their advantages and problems are analyzed. The spectrum of package modeling problems, best tackled with a differential TDR, is outlined
Keywords :
integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; time-domain reflectometry; JEDEC standard; TDR; differential TDR; differential TDR package modeling techniques; differential TDR techniques; electrical package characterization; electronic packaging; package modeling problems; single-ended TDR modeling techniques; Background noise; Capacitance measurement; Current measurement; Electronics packaging; Fixtures; Impedance measurement; Inductance measurement; Noise measurement; Q measurement; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895521
