• DocumentCode
    2780414
  • Title

    A novel approach to delay calculations in interconnect structures

  • Author

    Mittra, R. ; Chakravarty, Sourav ; Kwon, Soon Jae

  • Author_Institution
    Lab. of Electromagn. Commun., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    Summary form only given. The paper presents a novel approach for calculating the time delay along interconnects by using a technique that departs from the traditional method for estimating the “slack” in digital circuits. It employs instead, a direct time domain calculation, or a frequency domain S-parameter technique, in conjunction with a domain decomposition scheme
  • Keywords
    S-parameters; delay estimation; digital circuits; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; time-domain analysis; delay calculations; digital circuits; direct time domain calculation; domain decomposition scheme; frequency domain S-parameter technique; interconnect structures; interconnects; time delay; Clocks; Delay effects; Delay estimation; Frequency domain analysis; Frequency estimation; Integrated circuit interconnections; Laboratories; Microstrip; State estimation; Transmission line discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    0-7803-6450-3
  • Type

    conf

  • DOI
    10.1109/EPEP.2000.895529
  • Filename
    895529