Title :
A novel approach to delay calculations in interconnect structures
Author :
Mittra, R. ; Chakravarty, Sourav ; Kwon, Soon Jae
Author_Institution :
Lab. of Electromagn. Commun., Pennsylvania State Univ., University Park, PA, USA
Abstract :
Summary form only given. The paper presents a novel approach for calculating the time delay along interconnects by using a technique that departs from the traditional method for estimating the “slack” in digital circuits. It employs instead, a direct time domain calculation, or a frequency domain S-parameter technique, in conjunction with a domain decomposition scheme
Keywords :
S-parameters; delay estimation; digital circuits; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; time-domain analysis; delay calculations; digital circuits; direct time domain calculation; domain decomposition scheme; frequency domain S-parameter technique; interconnect structures; interconnects; time delay; Clocks; Delay effects; Delay estimation; Frequency domain analysis; Frequency estimation; Integrated circuit interconnections; Laboratories; Microstrip; State estimation; Transmission line discontinuities;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895529
