Analysis of high temperature superconductors for electronic interconnection applications

An examination is made of the performance tradeoffs between conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor-device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. The analysis determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. The particular interconnection technologies for which high-temperature superconductors show the most promise are thus identified