DocumentCode :
2780615
Title :
Packaging With Multichip Modules
Author :
Charles, Harry K., Jr.
Author_Institution :
The Johns Hopkins University
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
206
Lastpage :
210
Keywords :
Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Gallium arsenide; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Multichip modules; Nonhomogeneous media; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639892
Filename :
639892
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2780615
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