Title :
Low temperature co-fired ceramic on metal (LTCC-M) packaging technology
Author :
Fathy, A. ; McGinty, F. ; Pendrick, V. ; Ayers, G. ; Geller, B. ; Narayan, Y. ; Thaler, B. ; Chen, H.D. ; Liberatore, M.J.
Author_Institution :
Sarnoff Corp., Princeton, NJ, USA
Abstract :
Sarnoff has developed a LTCC-M multilayer ceramic technology facilitating the integration of lumped and distributed elements into multi-chip substrates. Here, we describe our efforts in developing this technology, embedded component modeling, important design issues, and a CAD design kit
Keywords :
buried layers; capacitors; ceramic packaging; circuit CAD; inductors; integrated circuit design; integrated circuit modelling; integrated circuit packaging; multichip modules; resistors; CAD design kit; LTCC-M multilayer ceramic technology; LTCC-M packaging technology; design issues; distributed element integration; embedded component modeling; low temperature co-fired ceramic on metal packaging technology; lumped element integration; multi-chip substrates; Capacitors; Ceramics; Dielectric substrates; Microwave technology; Nonhomogeneous media; Packaging; Resistors; Software packages; Temperature; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895541
