Title :
A fully packaged finite-ground coplanar line-to-micromachined waveguide transition
Author :
Becker, James P. ; Lee, Yongshik ; East, Jack R. ; Katehi, Linda P B
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart
Keywords :
MMIC; circuit simulation; coplanar transmission lines; integrated circuit packaging; micromachining; waveguide discontinuities; waveguide transitions; 26.5 to 40 GHz; 56 to 100 GHz; Ka-band transition; Si; W-band design transfer; full-wave simulations; metal waveguide; modified simulation structure; packaged finite-ground coplanar line-to-micromachined waveguide transition; packaged planar line-to-silicon micromachined waveguide transition; packaged silicon waveguide; Coplanar waveguides; Dielectric losses; Electromagnetic waveguides; Packaging; Planar waveguides; Probes; Rectangular waveguides; Silicon; Waveguide components; Waveguide transitions;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895544
