Title :
Development of a millimeter wave system-on-a-package utilizing MCM integration
Author :
Pham, A. ; Laska, J. ; Krishnamurthy, Vikram ; Bates, D. ; Marcinkewicz, W. ; Schmansk, B. ; Piacente, P. ; Sprinceanu, L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Abstract :
We present the development of integral passive components in a multilayer polyimide MCM technology that is suitable for developing a millimeter wave system-on-a-package. For the first time, we demonstrate the direct integration of a Wilkinson power divider/combiner circuit onto a Kapton based multilayer flex interconnect using integral Ta2 N thin-film resistors. The integral Wilkinson power divider/combiner achieves a measured insertion loss of less than 0.5 dB at V-band (60 GHz). In this paper, we also present results on the integration of a power combining subsystem with MMICs to develop a system-on-a-package at 60 GHz
Keywords :
MIMIC; integrated circuit interconnections; integrated circuit packaging; losses; multichip modules; plastic packaging; power combiners; power dividers; thin film resistors; 0.5 dB; 60 GHz; Kapton based multilayer flex interconnect; MCM integration; MMICs; Ta2N; V-band; Wilkinson power divider/combiner circuit; direct integration; integral Ta2N thin-film resistors; integral Wilkinson power divider/combiner; integral passive components; measured insertion loss; millimeter wave system-on-a-package; multilayer polyimide MCM technology; power combining subsystem integration; system-on-a-package; Flexible printed circuits; Integrated circuit interconnections; Millimeter wave circuits; Millimeter wave measurements; Millimeter wave technology; Nonhomogeneous media; Polyimides; Power dividers; Power system interconnection; Thin film circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location :
Scottsdale, AZ
Print_ISBN :
0-7803-6450-3
DOI :
10.1109/EPEP.2000.895545
