• DocumentCode
    2780794
  • Title

    Military Multichip Module Packaging Design And Manufacture

  • Author

    Cleveland, C. ; Pietila, D. ; Rassaian, M. ; White, T.

  • Author_Institution
    Boeing Defense & Space Group
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    211
  • Lastpage
    218
  • Keywords
    Assembly; Bonding; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Multichip modules; Space technology; Substrates; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639893
  • Filename
    639893
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2780794