Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

Author

Zheng, Ji ; Tripathi, Vijai K. ; Weisshaar, Andreas

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

fYear

2000

fDate

2000

Firstpage

333

Lastpage

336

Abstract

A quasi-static EM solver based on partial element equivalent circuits is applied to characterize multiple coupled microstrip on-chip interconnects on silicon. The EM solver takes into account the substrate skin effect as well as the conductor skin and proximity effects. Equivalent circuits consisting of only ideal passive elements are extracted from the EM data. Extraction results are presented for a coupled three-line interconnect structure

Keywords

coupled transmission lines; electromagnetic field theory; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; microstrip lines; skin effect; EM data extraction; EM solver; Si; conductor proximity effect; conductor skin effect; coupled three-line interconnect structure; equivalent circuits; ideal passive elements; modeling; multiple coupled microstrip on-chip interconnects; multiple coupled on-chip interconnects; partial element equivalent circuits; quasi-static EM solver; silicon substrate; substrate skin effect; Conductors; Coupling circuits; Equivalent circuits; Frequency; Inductance; Integrated circuit interconnections; Microstrip; Proximity effect; Silicon; Skin effect;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895557

Filename

895557