DocumentCode
2781294
Title
Process Modelling And Advanced Design Techniques For A Multi-chip Hybrid Package
Author
Kadakia, Suresh D. ; Donovan, Thomas E. ; Gupta, Dinesh
Author_Institution
IBM Corporation
fYear
1992
fDate
28-30 Sep 1992
Firstpage
227
Lastpage
230
Keywords
Atherosclerosis; Ceramics; Conducting materials; Electronics packaging; Manufacturing processes; Semiconductor thin films; Sputtering; Substrates; Transistors; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639896
Filename
639896
Link To Document