DocumentCode :
2781294
Title :
Process Modelling And Advanced Design Techniques For A Multi-chip Hybrid Package
Author :
Kadakia, Suresh D. ; Donovan, Thomas E. ; Gupta, Dinesh
Author_Institution :
IBM Corporation
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
227
Lastpage :
230
Keywords :
Atherosclerosis; Ceramics; Conducting materials; Electronics packaging; Manufacturing processes; Semiconductor thin films; Sputtering; Substrates; Transistors; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639896
Filename :
639896
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2781294
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