• DocumentCode
    2781295
  • Title

    Accelerated lifetime measurements on thin film ferroelectric materials with a high dielectric constant

  • Author

    Roest, Aarnoud ; Reimann, Klaus ; Klee, Mareike

  • Author_Institution
    NXP Semicond., Eindhoven
  • fYear
    2007
  • fDate
    11-13 Sept. 2007
  • Firstpage
    402
  • Lastpage
    405
  • Abstract
    This paper discusses the investigation of thin film ferroelectric capacitors (high-K) with respect to resistance degradation. Accelerated lifetime tests under elevated temperatures of 210-290degC and dc fields of 25-250 kV/cm were performed on these high-K capacitors. The capacitors were studied, making use of the lifetime specifications for ceramic multi-layer capacitors. The increase of the current density by one order of magnitude is here defined as the lifetime of the capacitors. The capacitor under these conditions is still functioning and therefore this is not the lifetime as determined by a breakdown. The accelerated lifetime measurements are used to investigate activation energies and voltage dependences, to enable the extrapolation of the lifetime to operation conditions. It was found that the resistance degradation of these thin film capacitors is a thermally activated process. Activation energies of 1.1-1.6 eV have been determined. An activation energy dependence on the voltage (Eact* = Eact-f2*V) has been fitted. For the voltage dependence of the lifetime an exponential dependence has been found.
  • Keywords
    current density; ferroelectric materials; life testing; permittivity; thin film capacitors; accelerated lifetime measurements; activation energy dependence; current density; high dielectric constant; high-K capacitors; lifetime extrapolation; multi-layer capacitors; resistance degradation; temperature 210 degC to 290 degC; thin film capacitors; thin film ferroelectric materials; Acceleration; Capacitors; Degradation; Dielectric thin films; Ferroelectric materials; High K dielectric materials; High-K gate dielectrics; Lifetime estimation; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 2007. ESSDERC 2007. 37th European
  • Conference_Location
    Munich
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-1123-8
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2007.4430963
  • Filename
    4430963