Title :
A Sizing Methodology for On-Chip Switched-Capacitor DC/DC Converters
Author :
De Vos, J. ; Flandre, Denis ; Bol, David
Author_Institution :
ICTEAM Inst., Univ. catholique de Louvain, Louvain-la-Neuve, Belgium
Abstract :
This paper proposes a systematic sizing methodology for switched-capacitor DC/DC converters aimed at maximizing the converter efficiency under the die area constraint. To do so, we propose first an analytical solution of the optimum switching frequency to maximize the converter efficiency. When the parasitic capacitances are low, this solution leads to an identical contribution of the switches and transfer capacitors to the converter output impedance. As the parasitic capacitances increase, the optimum switching frequency decreases. Secondly, optimum capacitor and switch sizes for maximum efficiency are provided. We show that the overdrive voltage strongly impacts the optimum switch width through the modification of their conductance. To support the sizing methodology, a model of the efficiency of switched-capacitor DC/DC converters is developed. It is validated against simulation and measurement results in 65 nm and 0.13 μm CMOS, respectively. The proposed sizing methodology shows how the converter efficiency can be traded-off for die area reduction and what is the impact of parasitic capacitances on the converter sizing.
Keywords :
CMOS analogue integrated circuits; DC-DC power convertors; switched capacitor networks; CMOS analog integrated circuits; converter efficiency; die area constraint; on-chip switched-capacitor DC-DC converters; optimum capacitor; optimum switch width; optimum switching frequency; parasitic capacitances; size 0.13 mum; size 65 nm; systematic sizing methodology; transfer capacitors; Capacitance; Capacitors; DC-DC power converters; Impedance; Switches; Switching frequency; Topology; CMOS analog integrated circuits; DC/DC power conversion; power management; subthreshold design; switched-capacitor networks; voltage regulator;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2013.2285692