• DocumentCode
    2781488
  • Title

    Fundamental studies on the front contact formation resulting in a 21% efficiency silicon solar cell with printed rear and front contacts

  • Author

    Hörteis, M. ; Benick, J. ; Nekarda, J. ; Richter, A. ; Preu, R. ; Glunz, S.W.

  • Author_Institution
    Fraunhofer Inst. for Solar Energy Syst., Freiburg, Germany
  • fYear
    2010
  • fDate
    20-25 June 2010
  • Abstract
    The contact formation on high efficiency solar cells using a high temperature process is the subject of this research. The chemical reactions between ink components and solar cell during the contact firing process are studied in detail by thermal gravimetric - differential thermo analysis. The mechanism behind the etching process and the opening of the dielectric layer are explained and the impact of the glass frit is investigated. Based on these studies, a seed layer ink was developed, optimized and tested on silicon solar cells. The developed ink was applied on high efficiency solar cells with printed front and rear contacts. At the rear side, we used a firing stable passivation layer consisting of Al2O3 and SiNx, which additionally resists the reactive compounds of the screen printed Al-paste. After applying laser fired contacts at the rear and light induced silver plating at the front, cell efficiencies of η = 21% and fill factors of 81% could be measured.
  • Keywords
    aluminium compounds; etching; passivation; silicon compounds; solar cells; thermal analysis; Al2O3; SiN; chemical reactions; contact firing process; dielectric layer; etching process; firing stable passivation layer; front contact formation; front contacts; glass frit; high temperature process; ink components; laser fired contacts; light induced silver plating; printed rear contacts; seed layer ink; silicon solar cell; thermal gravimetric-differential thermo analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
  • Conference_Location
    Honolulu, HI
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-5890-5
  • Type

    conf

  • DOI
    10.1109/PVSC.2010.5616892
  • Filename
    5616892