• DocumentCode
    2782167
  • Title

    The effect of CdTe deposition temperature on device properties of different TCOs and glass substrates

  • Author

    Dhere, Ramesh ; Bonnet-Eymard, Max ; Charlet, Emilie ; Peter, Emmanuelle ; Duenow, Joel ; Moutinho, Helio ; Li, Jian V. ; Scott, Marty ; Albin, Dave ; Gessert, Tim

  • Author_Institution
    Nat. Renewable Energy Lab., Golden, CO, USA
  • fYear
    2010
  • fDate
    20-25 June 2010
  • Abstract
    In this paper, we present our work on devices fabricated using CdTe films deposited by close-spaced sublimation using substrate temperatures in the range of 450° to 620°C. We studied devices prepared on Saint-Gobain soda lime SGG Diamant and Corning 7059 borosilicate glass substrates. We used four types of contact: SnO2:F, ITO, CTO, and Saint-Gobain AZO with and without high-resistivity buffer layers. We used a variety of buffer layers: undoped SnO2, zinc tin oxide (ZTO), and proprietary Saint-Gobain buffer layers. A buffer layer is crucial for devices using CTO and AZO as the front contact. For AZO layers developed by Saint-Gobain, we achieved 9% efficiency without a buffer layer and over 12% efficiency using buffer layers when CdTe films are deposited below 500°C. We used standard current density-voltage and quantum efficiency analysis to determine the device parameters.
  • Keywords
    buffer layers; cadmium compounds; fluorine; glass; semiconductor thin films; sublimation; tin compounds; CTO; CdTe; Corning 7059 borosilicate glass substrates; ITO; Saint-Gobain AZO; Saint-Gobain soda lime SGG Diamant; SnO2:F; TCO; buffer layers; close-spaced sublimation; deposition temperature effect; device properties; devices fabrication; temperature 450 C to 620 C; Annealing; Buffer layers; Glass; Indium tin oxide; Performance evaluation; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
  • Conference_Location
    Honolulu, HI
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-5890-5
  • Type

    conf

  • DOI
    10.1109/PVSC.2010.5616929
  • Filename
    5616929