Title :
2007 International Reliability Physics Symposium
Abstract :
The following topics are dealt with: transistors; memory; high-k dielectrics; product and circuit reliability; assembly and packaging; interconnects; microelectronics in extreme environments; organics; soft error rate; electrostatic discharge and latchup; process integration reliability; MEMS; compound semiconductors; high voltage devices; and failure analysis.
Keywords :
electronics packaging; electrostatic discharge; failure analysis; high-k dielectric thin films; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; microassembling; micromechanical devices; transistors; MEMS; assembly; circuit reliability; compound semiconductors; electronics packaging; electrostatic discharge; failure analysis; high voltage devices; high-k dielectrics; integrated circuit interconnects; latchup; memory; microelectronics; organics; process integration reliability; product reliability; soft error rate; transistors;
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0918-7
DOI :
10.1109/RELPHY.2007.369853
